This publication, rich in technological expertise, explores the impact of dense ball-grid array BGA packages with high pin-count on PCB printed circuit board design, and provides solutions for inherent design challenges. Categories Editor's Choice. Multimedia, Videos. Design Automation. Electronics Technology.
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This publication, rich in technological expertise, explores the impact of dense ball-grid array BGA packages with high pin-count on PCB printed circuit board design, and provides solutions for inherent design challenges.
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Is it possible to find a tutorial of BGA fanout?
Short on time? That's right, you can learn the principles for successful BGA routing in just 30 minutes! Even if you can read words per minute, Charles' webcast will be hard to beat. That's smart because layers affect both fabrication costs and product reliability. But these same designers struggle when routing the high-pin-count ball grid arrays BGAs that are becoming increasingly popular with electronics manufacturers.
BGA Routing: When Less is More!
When you breakout a BGA, you basically apply a fanout solution. You route traces from those fanouts to the perimeter of the device prior to general routing of the PCB. Here are two examples of a. Since there is not just one but multiple ways to breakout a BGA, we are giving you an example of how to breakout a. A good design practice is to do the layout part by part. You need to make sure that you will be able to fanout and connect all the pads under the BGA. Another good design practice is to draw short tracks.