IPC JEDEC J-STD-033B.1 PDF

Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. Copyright All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. We would like to thank them for their dedication to this effort.

Author:Grosar Meztidal
Country:Montserrat
Language:English (Spanish)
Genre:Finance
Published (Last):10 July 2006
Pages:286
PDF File Size:14.3 Mb
ePub File Size:9.81 Mb
ISBN:519-3-25917-411-3
Downloads:11471
Price:Free* [*Free Regsitration Required]
Uploader:Arasho



Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally.

Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. Copyright All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.

We would like to thank them for their dedication to this effort. Any standard involving a complex technology draws material from a vast number of sources.

While the principal members of the Joint Moisture Classi? Maurice Brodeur, Analog Devices Inc. Francois Monette, Cogiscan Inc.

Marty Rodriguez, Jabil Circuit, Inc. Heidi Reynolds, Oracle America, Inc. Amol Kirtikar, Sud-Chemie Inc. Mass Re? Localized Heating Socketed Components Point-to-Point Soldering Aqueous Cleaning General Considerations for Baking High Temperature Carriers Low Temperature Carriers Paper and Plastic Container Items Bakeout Times Bar Code Label Bulk Re?

Solder Re? Upon Receipt Component Inspection Floor Life IPC Standards Joint Industry Standards Department of Defense This document describes the standardized levels of? For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. During solder re? Typical solder re? Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity,?

These methods are provided to avoid damage from moisture absorption and exposure to solder re? By using these procedures, safe and damage-free re? The dry-packing process de? It does not apply to bulk solder re? Such processes are not allowed for many SMDs and are not covered by the component quali?

Refer to Clause 6. Such SMD packages are not at risk and do not require moisture precautionary handling.

The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount re? Special consideration should be given to non-hermetic cavity packages. Note: This speci? Note: For the purpose of this standard, the bar code label is on the lowest level shipping container and includes information that describes the product e.

Note: The HIC is packed inside the moisture-barrier bag, along with a desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices have been subjected.

Note: For the purpose of this standard, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials. As a minimum, all materials used in dry packing should conform to EIA The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts.

If the distributor practice is to repack the MBBs with active desiccant, then this time does not need to be subtracted from the MET. Therefore, the effect of these materials must be compensated for by baking or, if required, adding additional desiccant in the MBB to ensure the shelf life of the SMD packages. An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture weight gain to an acceptable level.

A representative dry-pack con? The bags shall be heat sealable. The desiccant material shall be packaged in moisture permeable bags or pouches. For comparison between various desiccant types, military speci? A UNIT of desiccant is de? This value should to be obtained from the desiccant manufacturer. When this option is used, it must be veri?

Note 2: No moisture-absorbing material e. Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life see Clause 5.

This can be determined by weighing a representative quantity of material known to be at equilibrium with the manufacturing environment, baking to a new constant weight, and subtracting the?

When dry packing, the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB. An example HIC is shown in Figure The spots shall indicate the humidity with a signi? Hue shall be tested using the test method in Appendix A.

The colors shall be described in writing on the card. The caution label shall be affixed to the outside surface of the MBB. The caution label includes? If the calculated shelf life is greater than 12 months, item 1 of the caution label should be changed accordingly. Level 1 parts classi? The caution label shall be affixed to the MBB if used or to the lowest-level shipping container.

The caution label is not required if a bar code label includes the Level 1 classi? C If blank, see adjacent bar code label 3. Light air evacuation may be used to reduce the packaging bulk and enhance carton packing Figure If the calculated shelf life is greater than 12 months, item 1 of the caution label should be changed accordingly see Figure Drying per an allowable option resets the?

If dried and sealed in an MBB with fresh desiccant, the shelf life is reset. Tables , , and give reference conditions for drying SMD packages. Table gives conditions for rebake of SMD packages at a user site after the? Table summarizes conditions for resetting or pausing the? The supplier shall formally communicate to the distributor the maximum time that the product may be left unsealed at the distributor before rebaking is required.

Note: If bake is interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time. However, if the conditions of Clause 4. Users may reduce the actual bake time if technically justi? In most cases it is applicable to other nonhermetic surface mount SMD packages. Note 2: The bake times speci?

For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table if packages have had extended exposure to factory ambient before bake. Also the actual bake time may be reduced if technically justi?

This can be accomplished by dry pack according to Clause 3. For components exposed anytime less than their stated? Once the? If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers. This is particularly critical if SMD packages are handled under low humidity conditions e.

The temperature and time for baking SMD packages are therefore limited by solderability considerations. The bags should be inspected to verify there are no holes, gouges, tears, punctures, or openings of any kind that would expose either the contents or an inner layer of a multilayer bag.

HYPOTHYROIDIE CONGENITALE PDF

IPC/JEDEC J-STD-033C

The advent of surface mount devices SMDs introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity, flux sensitivity, or cleaning process sensitivity. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Scope This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with moisture-permeable materials epoxies, silicones, etc.

EL CLUB BILDERBERG LOS AMOS DEL MUNDO CRISTINA MARTIN PDF

Access denied

.

APEXIS APM-J011-WS PDF

IPC JSTD 033B01

.

KAMAYANI BOOK PDF

Popular Publishers

.

Related Articles